Mold and a method for manufacturing the same

ABSTRACT

A mold includes a mold insert body made of at least two kinds of materials. The materials have different coefficients of thermal conductivity. The mold insert body includes a union part formed by sintering the materials, and the union part has a configuration set so as to correspond to a cooling way of a molding material flowed in a cavity forming part of the mold.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to molds and methods for manufacturing thesame.

2. Description of the Related Art

In an injection molding machine of the related art, resin heated andmelted in a heating cylinder is injected into a cavity of a moldapparatus under high pressure so that the cavity is filled with themolten resin. The molten resin is then cooled and solidified so as toobtain a molded article.

The injection molding machine includes an injection apparatus, a moldclamping apparatus and the mold apparatus. The mold apparatus isprovided with a stationary mold and a movable mold. The mold clampingapparatus includes a stationary platen, a movable platen, a motor formold clamping, and others. The movable platen is advanced and retractedagainst the stationary platen by driving a motor for mold clamping, soas to perform mold closing, mold clamping and mold opening.

The injection apparatus includes a heating cylinder and an injectionnozzle. The resin supplied from a hopper is heated and melted by theheating cylinder. The molten resin is injected by the injection nozzle.A screw is disposed inside the heating cylinder so that the screw can berotated about an axis and can be advanced and retracted. The screw isadvanced by driving a motor for injection so that the resin is injectedby the injection nozzle. The screw is rotated by driving a motor formetering and thereby the screw is retracted and the resin is metered.

Meanwhile, in a case where precision parts such as a disk shapedsubstrate, a lens made of plastic, and the like are molded as a moldedarticle, the quality of the molded article is determined based on thecavity space of the mold apparatus. Because of this, the mold apparatusis required to have high precision for various measurements of the moldapparatus. Hence, the mold is manufactured by the following method.

It is noted that the molds (the stationary mold and the movable mold)forming the mold apparatus have not only the mold bodies such as thecavity and a core but also a mold insert body or a mold core bodyprovided with the mold body if necessary. Hence, in this specification,the “mold” is a general term of the mold body, the mold core body, andthe mold insert body. In a case where a disk shaped substrate is molded,a stamper is used as the mold insert body.

FIG. 1 is a vertical cross-sectional view of a mold of the related art.

Referring to FIG. 1, the mold insert body 11 forming a part of the moldincludes a mold prototype 12 and a nickel-phosphorus plating layer 13.The mold prototype 12 is a prototype of the mold insert body 11.

The mold insert body 11 is manufactured by the following steps. In thefirst step, a base material blank made of steel material such as SKD 61including chrome of approximately 2-5% is formed. In the second step,rough processing is performed on the base material as having an errorrange of 20-200 [μm] so that the mold prototype 12 is formed. Next, inthe third step, hardening and tempering are performed on the moldprototype 12.

In the fourth step, electroless nickel-phosphorus plating is performedon a mold surface S2 forming at least the cavity space of the moldprototype 12. As a result of this, a plating layer having a thickness ofat least 100-200 [μm], namely the nickel-phosphorus plating layer 13, isformed.

In the fifth step, a heat treatment at a temperature of 300-400 degreescentigrade is performed, so that stress of the nickel-phosphorus platinglayer 13 is removed and hardness (HRC) of 50-54 is set.

In the sixth step, external diameter processing is performed against theentire mold prototype 12 using a grindstone so that a reference plane isformed. After that, in the seventh step, rough configuration processingis performed on the nickel-phosphorus plating layer 13 by diamond bitcutting so that a cavity forming surface is produced. In the eighthstep, a finishing process is performed on the nickel-phosphorus platinglayer 13 of the cavity forming surface by diamond bit cutting so thatthe mold is finished.

In this case, the surface layer of the nickel-phosphorus plating layer13 is amorphous. Therefore, as compared with a case where the finishingprocessing is performed on a part being in a crystalline state by thediamond bit cutting, a step due to the crystalline interface is notrequired to be included in the above mentioned steps. Hence, it ispossible to manufacture the mold with high precision.

In a case where the disk shaped substrate as the molded article ismolded by using the mold insert body 11 of the above mentioned relatedart, for example, the mold insert body 11 is set to the mold apparatusas a mold insert body (stamper) where a pattern of a hyperfineconvex-concave is formed on the mold surface S2 thereof. The resin fillsthe cavity of the mold apparatus so that the pattern formed on the moldsurface S2 is transferred to the resin. The resin is then cooled so thata prototype substrate is formed. At this time, the pattern istransferred to the prototype substrate.

And then, heat of the resin filling the cavity at the time of filling istransmitted to the mold prototype 12 via the nickel-phosphorus platinglayer 13. In this case, the nickel-phosphorus plating layer 13 generallyhas a small thickness of 100-200 [μm]. Hence, the heat of the resin istransmitted to the mold prototype 12 immediately so that the temperatureof the resin inside of the cavity space is reduced rapidly. Accordingly,the pattern cannot be transferred to the resin precisely. As a result ofthis, it is not possible to form a disk shaped substrate with highprecision and therefore quality of the molded article is degraded.

Furthermore, in the fourth step of the method for manufacturing the moldinsert body 11, electroless nickel-phosphorus plating is performed onthe surface forming at least the cavity of the mold prototype 12.However, work for electroless nickel-phosphorus plating not only isextremely troublesome but also takes a lot of time for manufacturing.Hence, the electroless nickel-phosphorus plating causes an increase ofthe manufacturing cost of the mold.

That is, in a case where the electroless nickel-phosphorus plating isperformed, first a plating processing is performed on the mold prototype12 in a plating bath after an ultrasonic cleaning, masking, strikingtreatment, or the like is performed. After that, the mold prototype 12is cleaned. Thus, a lot of steps are necessary for electrolessnickel-phosphorus plating.

Furthermore, in the above mentioned plating treatment, not only is theamount of the nickel-phosphorus adhering to the prototype mold 12 perunit time extremely small, but also the processing based on diamond bitcutting is required in the seventh and eighth steps. Because of this,since the nickel-phosphorus plating layer 13 is required to have a filmthickness of at least 100-200 [μm], it takes an extremely long time toform the nickel-phosphorus plating layer 13.

In addition, not only is it easy for bubbles to enter thenickel-phosphorus plating layer 13 at the time of forming thenickel-phosphorus plating layer 13, but also it is easy for thenickel-phosphorus plating layer 13 to peel off and have a straingenerated at the time of heat treatment of the nickel-phosphorus platinglayer 13 in the fifth step. In the above mentioned case, it is notpossible to manufacture the mold with a high precision, so that theyield rate becomes low.

Furthermore, in the plating treatment, there is a restriction of thecomposition of a plating liquid filling the plating bath. In addition,in a case where a steel material including chrome of approximately 13%is used as the base material blank, it is not possible to performelectroless plating on the base material blank and there is arestriction of the material of the base material blank. Therefore, it isdifficult to manage manufacturing conditions of the mold.

SUMMARY OF THE INVENTION

Accordingly, it is a general object of the present invention to providea novel and useful mold and a method for manufacturing the same, inwhich one or more of the problems described above are eliminated.

Another and more specific object of the present invention is to providea mold and a method for manufacturing the same whereby the quality ofthe molded articles can be improved, the manufacturing cost of the moldcan be reduced, the mold can be manufactured with high precision, theyield rates can be improved and the manufacturing condition of the moldcan be managed easily.

It is also an object of the present invention to provide a mold,including a mold insert body made of at least two kinds of materials,the materials having different coefficients of thermal conductivity. Themold insert body includes a union part formed by sintering thematerials. The union part has a configuration set so as to correspond toa cooling way of a molding material flowed in a cavity forming part ofthe mold.

It is also an object of the present invention to provide a mold,including a mold insert body, the mold insert body including: a baselayer that is made of a first material; and an outermost layer that ismade of a second material different from the first material of the baselayer and that forms a cavity forming part. A union part is formed bysintering the base layer and the outermost layer. The union part has aconfiguration set so as to correspond to a cooling way of a moldingmaterial flowed in the cavity forming part of the mold.

It is also an object of the present invention to provide a method formanufacturing a mold, including the steps of:

a) providing a powder of a first material;

b) providing a powder of a second material different from the powder ofthe first material so as to form a configuration that corresponds to acooling way of a molding material flowed in a cavity forming part of themold; and

c) sintering the respective powders by putting the powders of therespective materials between a first electrode and a second electrode,by pressuring with a designated pressure power, and by sending adesignated electric current to the powders of the respective materials.

Other objects, features, and advantages of the present invention willbecome more apparent from the following detailed description when readin conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a vertical cross-sectional view of a mold of the related art;

FIG. 2 is a schematic view showing a manufacturing apparatus of a moldof a first embodiment of the present invention;

FIG. 3 is a schematic view showing a manufacturing method of the mold ofthe first embodiment of the present invention;

FIG. 4 is a vertical cross-sectional view of the mold of the firstembodiment of the present invention;

FIG. 5 is a graph showing a specific characteristic of the mold of thefirst embodiment of the present invention;

FIG. 6 is a cross-sectional view showing a main part of a mold apparatusand an injection apparatus of the first embodiment of the presentinvention;

FIG. 7 is a view for explanation of a mold and molded article part of asecond embodiment of the present invention;

FIG. 8 is a view for explanation of a first deformation example of themold of the second embodiment of the present invention;

FIG. 9 is a view for explanation of a second deformation example of themold of the second embodiment of the present invention;

FIG. 10 is a view for explanation of a third deformation example of themold of the second embodiment of the present invention;

FIG. 11 is a view for explanation of a fourth deformation example of themold of the second embodiment of the present invention;

FIG. 12 is a view for explanation of a mold and molded article part of athird embodiment of the present invention; and

FIG. 13 is a view for explanation of a mold and molded article part of afourth embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

A description will now be given, with reference to FIGS. 2 through 13,of embodiments of the present invention. In the following examples, amold and a manufacturing method of the same whereby precision parts suchas a disk shaped substrate, a lens made of plastic, and the like aremolded as a molded article, will be described.

FIG. 2 is a schematic view showing a manufacturing apparatus of a moldof a first embodiment of the present invention. FIG. 3 is a schematicview showing a manufacturing method of the mold of the first embodimentof the present invention.

Referring to FIG. 2, a discharge plasma sintering apparatus 21 used formanufacturing the mold of the first embodiment of the present inventionincludes a housing 22 which has a cylindrical configuration and issealed. A chamber in the housing 22 is connected to a vacuum pump (notshown) as a vacuum generation source provided at an atmospheric controlpart 16. The chamber is evacuated by driving the vacuum pump. Instead ofmaintaining a vacuum inside of the housing 22, inactive gas such asargon gas and the like may fill the inside of the housing 22. Inaddition, a cooling pipe (not shown, is provided inside of a wall of thehousing 22. Cooling water as a cooling medium (not shown) circulatesinside of the cooling pipe so that the chamber is cooled. Because ofthis, the cooling pipe is connected to a cooling apparatus 17 via acooling system 41. The cooling water is supplied from the cooling system41 via the cooling pipe.

A die 31 is provided inside of the housing 22. The die 31 has acylindrical configuration and is made of conductive material such asgraphite. An upper punch 32 having a stick configuration and made of aconductive material such as graphite is provided over the die 31 as afirst punch. A lower punch 33 having a stick configuration and made of aconductive material such as graphite is provided below the die 31 as asecond punch. The upper punch 32 and the lower punch 33 are provided asfacing each other. A sinter mold 25 consists of the die 31, the upperpunch 32 and the lower punch 33.

A punch body part 23 is formed so as to project to the inside of the die31. Pushing pressure parts 24 having flange configurations are formed atthe upper end of the upper punch 32 and the lower end of the lower punch33 in a body with the punch body part 23.

In the present embodiment, the die 31, the upper punch 32, and the lowerpunch 33 are made of graphite. However, instead of graphite, anotherconductive material having a melting point of 1100 degrees centigrade ormore, such as tungsten (W), molybdenum (Mo), or carbon (C), may be usedfor the die 31, the upper punch 32, and the lower punch 33.

An upper electrode 34 as a first electrode is provided over the upperpunch 32 as extending in the vertical direction. A lower electrode 35 asa second electrode is provided below the lower punch 33 as extending inthe vertical direction.

The upper electrode 34 has an electrode terminal 43, an electrodeterminal 44, and a body part 45. The electrode terminal 43 is providedat the lower end of the upper electrode 34 and comes in contact with theupper punch 32. The electrode terminal 44 is provided at the upper endof the upper electrode 34 and connected to a direct current power supply37. The electrode terminals 43 and 44 are connected by the body part 45.The body part 45 is formed so as to pierce into the housing 22.

The lower electrode 35 has an electrode terminal 46, an electrodeterminal 47, and a body part 48. The electrode terminal 46 is providedat the upper end of the lower electrode 35 and comes in contact with thelower punch 33. The electrode terminal 47 is provided at the lower endof the lower electrode 35 and connected to the direct current powersupply 37. The electrode terminals 46 and 47 are connected by the bodypart 48. The body part 48 is formed so as to pierce into the housing 22.

Cooling pipe 53 is provided inside of the upper electrode 34 and coolingpipe 54 is provided inside of the lower electrode 35.

Cooling water circulates inside of the cooling pipes 53 and 54 so as tocool the upper electrode 34 and the lower electrode 35 and cool the die31 indirectly via the upper punch 32 and the lower punch 33. Atemperature sensor (not shown) as a temperature detection part isprovided at a designated part of the die 31. Output from the temperaturesensor is sent to a temperature detection apparatus 55. Therefore, it ispossible to detect temperatures of the die 31, the upper electrode 34and the lower electrode 35 by the temperature detection apparatus 55.

The upper electrode 34 and the lower electrode 35 are provided so as tobe able to move in up and down directions. A pressure mechanism 36 isconnected to an upper end part of the upper electrode 34 and a lower endpart of the lower electrode 35. Pressure P generated by the pressuremechanism 36 is transmitted to the upper electrode 34 and the lowerelectrode 35. By the pressure P, the upper electrode 34 is moved in adownward direction and the lower electrode 35 is moved in the upwarddirection.

Powder 30 for sintering is provided inside of the die 31. By driving thepressure mechanism 36 so as to move the upper electrode 34 and the lowerelectrode 35, the power 30 for sintering is pressured with the pressureP. A servo motor, a reduction gear, a hydraulic cylinder, an airpressure cylinder and the like may be used as a driving part (not shown)of the pressure mechanism 36.

In order to detect positions of the upper electrode 34 and the lowerelectrode 35, a position sensor (not shown) as a position detection partis provided so as to be adjacent to the upper electrode 34 and the lowerelectrode 35. A sensor output of the position sensor is sent to theposition detection apparatus 56. Hence, it is possible to detect thepositions of the upper electrode 34 and the lower electrode 35 by theposition detection apparatus 56.

In this embodiment, the upper electrode 34 and the lower electrode 35are provided so as to be able to move and the powder 30 for sintering ispressured by moving the upper electrode 34 and the lower electrode 35.However, the powder 30 for sintering may be pressured by fixing one ofthe upper electrode 34 and the lower electrode 35, and moving the otherof the upper electrode 34 and the lower electrode 35.

A designated pressure P is generated by the pressure mechanism 36. Acontrol part 38 is provided in order to transmit the pressure to theupper electrode 34 and the lower electrode 35 and generate a designatedvoltage with a designated pulse by the power supply 37. The control part38 is connected to the pressure mechanism 36 and the power supply 37.The control part 38 is also connected to the atmospheric control part16, the cooling apparatus 17, the temperature detection apparatus 55,and the position detection apparatus 56.

Based on a temperature detected by the temperature detection apparatus55 and a position detected by the position detection apparatus 56, thepressure P based on the pressure mechanism 36 is feed-back controlledand a pulse width, a voltage and the like based on the power supply 37is feed-back controlled. Furthermore, the cooling apparatus 17 is drivenbased on temperature, and the temperatures of the upper electrode 34 andthe lower electrode 35 are feed-back controlled.

In a case where discharge plasma sintering is performed by the dischargeplasma sinter apparatus 30 having the above mentioned structure, first,the upper electrode 34 is moved in an upper direction. As a result ofthis, the upper punch 32 is moved in the upward direction so as to openthe upward end of the die 31. Because of this, a filling room having aclosed bottom formed by the die 31 and the lower punch 33 is provided bythe powder 30 for sintering made of a designated material Next, theupper punch 32 and the upper electrode 34 are moved in the downwarddirection and the filling room is sealed. After that, pressure treatmentmeans of the control part 38 perform a pressure treatment. That is, thepressure mechanism 36 is operated and the upper electrode 34 and thelower electrode 35 are moved, so that the powder 30 for sintering ispressured by the designated pressure P.

Voltage application treatment means of the control part 38 perform avoltage application treatment. That is, the power supply 37 is operatedso that a electrifying pulse is provided between the upper electrode 34and the lower electrode 35 for approximately 10 minutes. That is, forexample, a voltage of 0.1-5 [V] is applied and pulse direct electricalcurrent of approximately 1000-8000 [A] is flowed between the upperelectrode 34 and the lower electrode 35. Thus, in this embodiment, thepulse direct electrical current is flowed. However, rectangular waveelectrical current, triangular wave electrical current, trapezoidal waveelectrical current, and the like may be flowed and alternatingelectrical current may be flowed. Furthermore, electrical current havingthe same value may be flowed for a designated time.

Because of this, the powder 30 for sintering is heated so as to have atemperature of approximately 500-3000 [°C.]. As a result of this, thepowder 30 for sintering is sintered by discharge plasma sintering sothat the powder 30 for sintering becomes a sintered body. In this case,heat is generated at a point where respective powders forming the powder30 for sintering contact each other, and thereby respective powders areconnected. Although a designated binder is applied to the powder 30 forsintering in order to provide good handleability of the powder 30 forsintering, the binder is blown off when the pulse electric current isflowed.

In this case, a first electrifying path, a second electrifying path, anda third electrifying path are formed. The first electrifying pathincludes the upper electrode 34-the upper puch 32-the powder 30 forsintering-the lower punch 33-the lower electrode 35. The secondelectrifying path includes the upper electrode 34-the upper puch 32-thedie 31-the lower punch 33-the lower electrode 35. The third electrifyingpath includes the upper electrode 34-the upper puch 32—an interface ofpowder for sintering and die (an interface of the powder 30 forsintering and the die 31)-the lower punch 33-the lower electrode 35. Itis possible to sinter the powder 30 for sintering properly bycontrolling the electric current flowing through the first electrifyingpath, the second electrifying path, and the third electrifying pathproperly.

Next, soon after that, the die 31, the upper punch 32, and the lowerpunch 33 are heated by Joule heat so that the temperature of thesintered body is maintained. And then, the sintered body is cooled bycooling water supplied from the cooling system 41 so that the mold iscompleted. At this time, time for maintaining the temperature of thesintered body is set as approximately 10-30 minutes and time for coolingthe sintered body is set as approximately 30 minutes.

And then, the upper punch 32 and the upper electrode 34 are raised andthe mold is taken off from the filling room.

Next, a mold manufactured by the above mentioned discharge plasmasintering apparatus 21 will be described.

FIG. 4 is a vertical cross-sectional view of the mold of the firstembodiment of the present invention.

Referring to FIG. 4, a mold insert body 61 is formed by at least twolayers having different coefficients of thermal conductivity (in thisembodiment, five layers having different coefficients of thermalconductivity). The mold insert body 61 forms a part of the mold. Themold insert body 61 includes a base layer 62, an outermost layer 63, anadiabatic layer 64, a first inclination layer 65, and a secondinclination layer 66.

The base layer 62 is made of a stainless steel group steel material. Thebase layer 62 functions as a first layer having a union surface S11 thatis plane. The outermost layer 63 is positioned at the outermost of themold insert body 61. The outermost layer 63 functions as a second layerforming a mold surface S13 that is plane and as a cavity forming part.The adiabatic layer 64 is formed between the base layer 62 and theoutermost layer 63. The adiabatic layer 64 is made of a material havinga low coefficient of thermal conductivity such as ceramic. The adiabaticlayer 64 functions as a third layer having a union surface S12 that isplane and as an intermediate layer. The first inclination layer 65 isformed between the base layer 62 and the adiabatic layer 64. The secondinclination layer 66 is formed between the outermost layer 63 and theadiabatic layer 64.

In this embodiment, neighboring layers of the base layer 62, theoutermost layer 63, the adiabatic layer 64, the first inclination layer65 and the second inclination layer 66 are connected by sintering. Theadiabatic layer 64 is formed so as to have a constant thickness in adiameter direction and an axial direction. Here, the union surface S11forms a union part between the base layer 62 and the adiabatic layer 64.The union surface S12 forms a union part between the adiabatic layer 64and the outermost layer 63.

In this embodiment, the base layer 62 is made of SUS 304 as a firstmaterial. The outermost layer 63 is made of pure nickel as a secondmaterial. The adiabatic layer 64 is made of zirconia (zirconium oxide:ZrO₂) as a third material.

The base layer 62 may be made of copper (Cu), titanium (Ti), and thelike instead of SUS 304. The outermost layer 63 may be formed aluminum(Al), copper (Cu), and the like instead of pure nickel. The adiabaticlayer 64 may be made of alumina (aluminum oxide: Al₂O₃) instead ofzirconia.

It is preferable for a material forming the outermost layer 63 to have amelting point of 400 [°C.] or more, a deep cutting tab, good mirrorplane characteristics and mold release characteristics, and resistanceto forming a pin hole.

In this embodiment, the adiabatic layer 64 is provided between theoutermost layer 63 and the base layer 62. Hence, heat of the resinfilling the cavity space C is gradually transmitted to a receiving plate75 (See FIG. 6) of the mold apparatus 71 via the outermost layer 63, thesecond inclination layer 66, the adiabatic layer 64, the firstinclination layer 65, and the base layer 62.

FIG. 5 is a graph showing a specific characteristic of the mold of thefirst embodiment of the present invention. In FIG. 5, the horizontalaxis represents time and the vertical axis represents temperature. Inthis case, since copper has a high coefficient of thermal conductivity,it is possible to improve the cooling effect by using copper for thebase layer 62.

Referring to FIG. 5, L1 represents a change of the temperature of themold surface S13 in a case where resin fills the cavity space C by usingthe mold insert body 61 (See FIG. 4) forming a part of the mold of thepresent invention. L2 represents a change of the temperature of the moldsurface S2 in a case where resin fills the cavity space C by using themold insert body 11 (See FIG. 1) forming a part of the mold of therelated art. Tm represents temperatures of the mold prototype 12 and thebase layer 62.

In the mold insert body 11 of the related art shown in FIG. 1, if theresin fills the cavity space C (See FIG. 6) at a timing of t1, heat ofthe resin filling the cavity space C is transmitted to the moldprototype 12. The temperature of the mold surface S2 is reduced rapidly.The molded article is taken at a timing of t2. The timing of t2 is atiming when a cooling step finishes without sufficient rise of thetemperature of the resin in the cavity space C. After that, when thetemperature of the mold surface S2 is matched with the temperature Tm ofthe mold prototype 12 at a timing of t3, the next step, namely thefilling step, starts.

In the mold insert body 61 forming the mold of the present inventionshown in FIG. 4, since the adiabatic layer 64 is formed, when the resinfills the cavity space C at a timing of t1, heat of the resin fillingthe cavity space C is not rapidly transmitted to the base layer 62 but atemperature of the mold surface S13 rises due to the heat of the resin.And then, the mold apparatus 71 shown in FIG. 6 is cooled. Since thebase layer 62 is made of copper, the mold surface S13 is then cooledrapidly so that the molded article is taken off at the timing of t2.After that, when the temperature of the mold surface S13 is matched withthe temperature Tm of the base layer 62 at a timing of t3, a next step,namely the filling step, starts.

Thus, in a case where the mold insert body 61 forming the mold of thepresent invention shown in FIG. 4 is used, the temperature of the moldsurface S13 can be raised just after the resin fills. Accordingly, thepattern can be transferred to the mold surface S13 with high precisionso that the quality of the disk shaped substrate can be improved.

Furthermore, by using copper as a base material of the base layer 62, itis possible rapidly reduce the temperature of the mold surface S13 thatis raised by the resin just after the resin fills. Hence, it is possibleto increase the temperature of the mold surface S13 without making themolding cycle longer so that the quality of the disk shaped substratecan be improved.

Meanwhile, although the base layer 62 and the outermost layer 63 aremade of metal, the adiabatic layer 64 is made of ceramic material.Therefore, if the base layer 62 and the outermost layer 63 and theadiabatic layer 64 are connected directly, undesirable stress isgenerated at the union parts due to changes of temperature so thatconnection characteristics becomes worse. Hence, the first inclinationlayer 65 formed between the base layer 62 and the adiabatic layer 64 ismade of the materials forming the base layer 62 and the adiabatic layer64. In addition, the second inclination layer 66 formed between theoutermost layer 63 and the adiabatic layer 64 is made of materialsforming the outermost layer 63 and the adiabatic layer 64.

In this embodiment, the first inclination layer 65 includes SUS304 as 50[mass%] and zirconia as 50 [mass%].

The second inclination layer 66 includes the pure nickel as 50 [mass%]and zirconia as 50 [mass%].

Accordingly, it is possible to improve connection characteristics of thebase layer 62, the outermost layer 63, and the adiabatic layer 64. Inaddition, peeling of the adiabatic layer 64 off the base layer 62 andthe outermost layer 63 can be prevented.

Next, a mold apparatus for molding the disk shaped substrate wherein themold insert body 61 has the above structure will be described.

FIG. 6 is a cross-sectional view showing a main part of a mold apparatusand an injection apparatus of the first embodiment of the presentinvention.

Referring to FIG. 6, the mold apparatus 71 includes a stationary mold 72and a movable mold 73. The movable mold 73 can make contact with andseparate from the stationary mold 72 by means of a mold clampingapparatus not shown. By contacting and separating of the movable mold73, mold closing, mold clamping and mold opening are performed. At thetime of mold closing and mold clamping, the cavity C is formed betweenthe stationary mold 72 and the movable mold 73.

The stationary mold 72 includes a mold plate 74 and a receiving plate75. The mold insert body 61 is set to the mold plate 74. The movablemold 73 includes a mold plate 76 and a receiving plate 77. The moldinsert body 78 is set to the mold plate 76. Here, the mold insert body78 has a same structure as the mold insert body 61.

In the stationary mold 72, a sprue 81 is formed by piercing thereceiving plate 75 and the mold plate 74. An injection nozzle 83 of theinjection apparatus comes in contact with the stationary mold 72. Whenthe resin is injected from the injection nozzle 83, the resin fills thecavity C via the gate 82 formed at the mold plate and via the sprue 81.The resin in the cavity C is then cooled so as to become a prototypesubstrate. After that, opening hole processing is performed against theprototype substrate by a cut punch not shown so that the disk shapedsubstrate can be obtained.

Next, referring to FIG. 3, a method for manufacturing the mold insertbodies 61 and 78 by using the discharge plasma sinter apparatus 21 shownin FIG. 2 will be described. Since the mold insert body 78 has the samestructure as the mold insert body 61, explanation of the mold insertbody 78 will be omitted and the only mold insert body 61 will bedescribed.

In this embodiment, as described above with reference to FIG. 4, themold insert body 61 has a laminated body structure wherein the baselayer 62, the first inclination layer 65, the adiabatic layer 64, thesecond inclination layer 66 and the outermost layer 63 are stacked.

A powder P (See FIG. 2) for sintering is provided in the filling room ofthe discharge plasma sintering apparatus 21 shown in FIG. 2. The powderP (See FIG. 2) for sintering is formed by a multilayer powdercorresponding to the base layer 62, the first inclination layer 65, theadiabatic layer 64, the second inclination layer 66 and the outermostlayer 63, shown in FIG. 4, respectively. In this embodiment, the baselayer 62, the first inclination layer 65, the adiabatic layer 64, thesecond inclination layer 66 and the outermost layer 63 are formed bysintering powders. However, a plate material or a solid such as a block,having designated layers, may be formed.

First, the upper punch 32 and the upper electrode 34 are raised so thatSUS 304 powder as a first powder is provided in the filling room so asto have a designated thickness. Next, a second powder is provided on thefirst powder. The second powder is a mix powder made by mixing the SUS304 powder as 50 [mass %] and zirconia as 50 [mass %], so as to have adesignated thickness.

After that, zirconia powder as a third powder is provided on the secondpowder so as to have a desirable thickness. And then, a mix powderwherein pure nickel powder as 50 [mass %] and zirconia powder as 50[mass %], as a fourth powder, are mixed is provided on the third powderso as to have a designated thickness.

And then, last, pure nickel powder as a fifth powder, is provided on theforth powder so as to have a designated thickness.

Thus, the first through fifth powder layers are formed by the firstthrough fifth powders, and powder 30 for sintering formed by amultilayer powder of the first through fifth powder layers is formed.

Next, the upper punch 32 and the upper electrode 34 are lowered anddischarge plasma sintering is performed on the powder 30 for sintering,so that the mold insert body 61 is formed in a body. Next, the upperpunch 32 and the upper electrode 34 are raised so that the mold insertbody 61 is taken off. Finishing processing to a molded surface of theoutermost surface 63 is performed by diamond bit cutting so that ahyperfine alternating convex-concave pattern is formed on the moldsurface S13. Thus, the mold insert body 61 is completed.

As described above, in the present invention, plating treatment is notperformed on the mold surface S11 of the mold insert body 61. Theoutermost layer 63 is formed by discharge plasma sintering. Hence, it ispossible to manufacture the mold insert body 61 easily and in a shortperiod of time. Therefore, it is possible to reduce the cost of the moldinsert body 61.

Furthermore, as shown in the following TABLE 1, the coefficient ofthermal expansion of SUS 304 used for the base layer 62 is 17.3×10⁻⁶[1/°K]. The coefficient of thermal expansion of pure nickel used for theoutermost layer 63 is 16.3×10⁻⁶ [1/°K]. The coefficient of thermalexpansion of zirconia used for the adiabatic layer 64 is 9.4×10⁻⁶[1/°K]. When the temperature is changed, differences of coefficient ofthermal expansion among SUS304, pure nickel, and zirconia are small.Here, TABLE 1 shows not only the coefficient of thermal expansion butalso the coefficient of thermal conductivity and specific heat.

Accordingly, since undesirable stress is not generated at the interfaceof the base layer 62 and the outermost layer 63 and the adiabatic layer64 by change of the temperature, a good connection characteristic can beobtained. TABLE 1 Coefficient Coefficient of thermal of thermalSintering Specific expansion conductivity temperature heat [1/° K] [W/m· ° K] [° C.] [J · kg · K] SUS304 17.3 × 10⁻⁶ 16.4 1000 504 Zirconia 9.4 × 10⁻⁶ 2 1000-1200 0.452 Alumina  7.6 × 10⁻⁶ 30.3 1000-1200 0.774Pure Nickel 16.3 × 10⁻⁶ 62.2  900-1000 594

Similarly, the coefficient of thermal expansion of alumina is 7.6×10⁻⁶[1/°K]. In a case where the temperature of alumina is raised, thedifferences of the coefficients of thermal expansion among SUS304, purenickel, and zirconia are small. Hence, even if alumina is used as thesecond material, since undesirable stress is not generated at theinterfaces of the base layer 62 and the outermost layer 63 and theadiabatic layer 64 by change of the temperature, a good connectioncharacteristic can be obtained.

Furthermore, the sintering temperature of SUS304 is about 1000 [°C.],the sintering temperature of pure nickel is about 900-1000 [°C], and thesintering temperature of zirconia is about 1000-1200 [°C]. Conditionsfor sintering of SUS304, pure nickel, and zirconia are equivalent.Therefore, it is possible to make the condition for sintering good sothat good connection characteristics can be obtained.

Since the plating treatment is not performed when the outermost layer 63is formed, a bubble does not enter the outermost layer 63 and a strainis not generated at the outermost layer 63. Therefore, it is possible tomanufacture the mold insert body 61 with high precision, and a highyield rate can be obtained. Furthermore, since there is no restrictionwith regard to materials of the base layer 62, it is possible to managemanufacturing conditions of the mold insert body 61 easily.

In addition, the first inclination layer 65 is formed between the baselayer 62 and the adiabatic layer 64. The second inclination layer 66 isformed between the outermost layer 63 and the adiabatic layer 64.Therefore, it is possible to improve connection characteristics of thebase layer 62, the outermost layer 63 and the adiabatic layer 64.

In this embodiment, after discharge plasma sintering is performed,finishing processing to the molded surface S13 of the outermost surface63 is performed by diamond bit cutting so that a pattern of a hyperfineconvex-concave is formed on the mold surface S13. Thus, the mold insertbody 61 is completed. However, a configuration of the disk shapedsubstrate, namely a mold pattern corresponding to the convex-concave,may be formed on a surface facing the powder 30 for sintering at thelower end of the upper punch 32. Because of this, finishing processingbased on diamond bit cutting can be avoided.

In this embodiment, first, the first through fifth powder layers areformed and the powder 30 for sintering is formed by the first throughfifth powder layers. And then, discharge plasma sintering is performedon the powder 30 for sintering. However, the first through fifth powdersmay be provided and sintered one after another, the powder for sinteringformed by a designated powder layer may be formed for every designatedpowder of the first through fifth powders is provided, and dischargeplasma sintering may be performed against the powder for sinteringgradually.

Furthermore, in this embodiment, SUS304 as 50 [mass %] and zirconia as50 [mass %] are included in the first inclination layer 65. Pure nickelas 50 [mass %] and zirconia 50 [mass %] are included in the secondinclination layer 66. However, the first inclination layer 65 and thesecond inclination layer 66 may each have further a multilayerstructure, and the contents of SUS304 and zirconia at the firstinclination layer 65 and the contents of pure nickel and zirconia at thesecond inclination layer 66 may be changed more gradually and moreconsecutively.

In this case, for example, the first inclination layer 65 is formed by alayer where SUS304 as 90 [mass%] and zirconia as 10 [mass%] areincluded, a layer where SUS304 as 80 [mass%] and zirconia as 20 [mass%]are included, a layer where SUS304 as 70 [mass%] and zirconia as 30[mass%] are included, a layer where SUS304 as 60 [mass%] and zirconia as40 [mass%] are included, a layer where SUS304 as 50 [mass%] and zirconiaas 50 [mass%] are included, a layer where SUS304 as 40 [mass%] andzirconia as 60 [mass%] are included, a layer where SUS304 as 30 [mass%]and zirconia as 70 [mass%] are included, a layer where SUS304 as 20[mass%] and zirconia as 80 [mass%] are included, and a layer whereSUS304 as 10 [mass%] and zirconia as 90 [mass%] are included.

Furthermore, the second inclination layer 66 is formed by a layer wherezirconia as 90 [mass%] and pure nickel as 10 [mass%] are included, alayer where zirconia as 80 [mass%] and pure nickel as 20 [mass%] areincluded, a layer where zirconia as 70 [mass%] and pure nickel as 30[mass%] are included, a layer where zirconia as 60 [mass%] and purenickel as 40 [mass%] are included, a layer where zirconia as 50 [mass%]and pure nickel as 50 [mass%] are included, a layer where zirconia as 40[mass%] and pure nickel as 60 [mass%] are included, a layer wherezirconia as 30 [mass%] and pure nickel as 70 [mass%] are included, alayer where zirconia as 20 [mass%] and pure nickel as 80 [mass%] areincluded, and a layer where zirconia as 10 [mass%] and pure nickel as 90[mass%] are included.

Thus, it is possible to further improve the connection characteristicsof the base layer 62, the outermost layer 63, and the adiabatic layer 64by making the first inclination layer 65 and the second inclinationlayer 66 have multilayer structures.

Next, the second embodiment of the present invention will be described.

FIG. 7 is a view for explanation of a mold and molded article part of asecond embodiment of the present invention.

In the second embodiment of the present invention, a configuration of aunion part of the base layer 162 and the adiabatic layer 164 correspondsto a cooling way of resin in the cavity of the mold, namely a coolingway of resin so as to have substantially equal temperature of respectiveparts of a molded article when the molded article is taken off from thecavity C.

Referring to FIG. 7, the mold insert body 161 forming a part of the moldincludes the base layer 162, the outermost layer 163, and the adiabaticlayer 164. The base layer 162 is formed by a first material. Theoutermost layer 163 is formed by a second material. The adiabatic layer164 is formed by a third material having a low coefficient of thermalconductivity and functions as an intermediate layer. Here, forconvenience for explanation, the first inclination layer 65 and thesecond inclination layer 66 are omitted in FIG. 7.

The prototype substrate 171 is provided inside of the cavity C shown inFIG. 6. The sprue part 172 is provided inside of the sprue 81 shown inFIG. 6. The prototype substrate 171 and the sprue part 172 form a moldedarticle part.

In a case where a disk shaped substrate is molded as a molded article,the mold insert body 161 is used for a stamper where a pattern formed bya hyperfine convex-concave is formed on the mold surface. The moldinsert body 161 is set to the mold apparatus 71 shown in FIG. 6 and theresin as a molding material fills the inside of the cavity C of the moldapparatus 71. When the resin is cooled, the prototype substrate 171 isformed. At this time, the pattern is transferred to the prototypesubstrate 171.

Referring to FIG. 6, the resin injected from the injection nozzle 83fills the cavity C via the sprue 81 and the gate 82. In the cavity C,the resin flows from a vicinity of the gate 82 and the sprue 81 to partsremote from the gate 82 and the sprue 81 (in this embodiment, from acenter part of the cavity C to the peripheral part of the cavity C).Therefore, when the resin flows inside of the cavity C so as to becooled by the mold plates 74 and 76, as being positioned near the centerpart, the temperature of the resin is high; as being positioned near theperipheral part, a temperature of the resin is low.

In this embodiment, the thickness of the adiabatic layer 164 shown inFIG. 7 is partially varied. That is, a configuration of a union part ofthe base layer 162 and the adiabatic layer 164 corresponds to a coolingway of resin in a cavity of the mold, namely a cooling way of resin soas to have substantially equal temperature of respective parts of amolded article when the molded article is taken off from the cavityspace C. More specifically, the thickness of the adiabatic layer 164 isgradually increased from the center part to the peripheral part.

Therefore, the cooling rate is set to be high as being positioned closeto the center part. The cooling rate is set to be low as beingpositioned close to the peripheral part. Therefore, the temperaturedistribution of the resin becomes equal in a diameter direction (from acenter part to a peripheral part), and thereby it is possible to avoid ageneration of strain of the molded article based on a difference of atemperature after the molded article is taken off from the cavity C.Hence, it is possible to transfer the pattern with high precision andimprove the quality of the disk shaped substrate. Furthermore, since itis possible to equalize the distribution of birefringence ratiorepresenting a performance of the disk shaped substrate in a diameterdirection, it is possible to further improve the quality of the diskshaped substrate.

In this embodiment, in order to correspond to a cooling way of resin ina cavity of the mold, namely a cooling way of resin so as to havesubstantially equal temperature of respective parts of a molded articlewhen the molded article is taken off from the cavity C, the thickness ofthe adiabatic layer 164 is increased from the center part to theperipheral part.

However, the present invention is not limited to being applied as in theabove; a configuration of a union part of the base layer 162 and theadiabatic layer 164 may be set based on the following two conditions.

As the first condition, the thickness of the cavity C should beconsidered.

FIG. 8 is a view for explanation of a first deformation example of themold of the second embodiment of the present invention. Referring toFIG. 8, a mold insert body 161-1 of a first deformation example of themold of the second embodiment of the present invention includes a baselayer 162-1, an outermost layer 163-1 and an adiabatic layer 164-1.

As shown in FIG. 8, when the resin flows from the gate 82 and moves intothe cavity C, if a thickness of the cavity C in a directionperpendicular to a moving direction is not equal, it is necessary tochange the thickness of the adiabatic layer 164-1. As the thickness ofthe cavity C is increased, the cooling rate of the resin is slowed andtherefore it is necessary to make the thickness of the adiabatic layer164-1 less.

However, even if the thickness of the cavity C is uniform, the coolingrate against respective parts inside of the cavity C of the resin isdifferent based on the thickness of the molded article.

FIG. 9 is a view for explanation of a second deformation example of themold of the second embodiment of the present invention. Referring toFIG. 9, a mold insert body 161-2 of a second deformation example of themold of the second embodiment of the present invention includes a baselayer 162-2, an outermost layer 163-2 and an adiabatic layer 164-2 andis used for manufacturing a thin walled product such as a Digital VideoDisk(DVD) or a Compact Disk(CD). FIG. 10 is a view for explanation of athird deformation example of the mold of the second embodiment of thepresent invention. Referring to FIG. 10, a mold insert body 161-3 of athird deformation example of the mold of the second embodiment of thepresent invention includes a base layer 162-3, an outermost layer 163-3and an adiabatic layer 164-3 and is used for manufacturing a thickwalled product thicker than the Digital Video Disk(DVD) or the CompactDisk(CD).

Meanwhile, when the resin fills from the gate 82 to the cavity C, thethin layer called the skin layer is formed on an inside wall of thecavity C from the vicinity of the gate 82, so that the skin layer iscooled and performs solid soon. Since the resin flows an inside of theskin layer, as shown in FIG. 9, as the cavity C becomes thinner, theresin is cooled. Hence, the difference of the cooling rate of the resinagainst respective parts in the cavity C become greater. As beingfarther from the gate 82, it is necessary to make the thickness of theadiabatic layer 164-2 greater.

On the other hand, as shown in FIG. 10, as the thickness of the cavity Cis greater, the differences of the cooling rates of the resin againstrespective parts in the cavity C become less. That is, there is littledifference between the cooling rates in the vicinity of the gate 82 andthe far point from the gate 82. Hence, it is not necessary to vary thethickness of the adiabatic layer 164-3 as compared with the adiabaticlayer 164-2 shown in FIG. 2.

As a second condition, when the resin flows in the cavity C, it isnecessary to consider the difference of the temperature of the resinagainst respective parts of the cavity C.

FIG. 11 is a view for explanation of a fourth deformation example of themold of the second embodiment of the present invention. Referring toFIG. 11, a mold insert body 161-4 of the fourth deformation example ofthe mold of the second embodiment of the present invention includes abase layer 162-4, an outermost layer 163-4, and an adiabatic layer164-4. When the resin flows in the cavity C, the resin passes throughthe gate 82. Therefore, since the resin flows in the vicinity of thegate 82 in the cavity C last when the resin fills in the cavity C, thetemperature of the resin in the vicinity of the gate 82 is high. Asbeing further from the gate 82, the temperature of the resin is lower.Hence, as being farther from the gate, it is necessary to make thethickness of the adiabatic layer 164-4 greater.

Next, a third embodiment of the present invention, which applies to amold for molding a lens made of plastic as a molded article, will bedescribed.

FIG. 12 is a view for explanation of a first deformation example of themold of the third embodiment of the present invention.

Referring to FIG. 12, a mold insert body 261 forming a part of the moldincludes a base layer 262, an outermost layer 263, and an adiabaticlayer 264. The base layer 262 is made of a first material. The outermostlayer 263 is made of a second material. The adiabatic layer 264 is madeof a third material having a low coefficient of thermal conductivity andfunctions as an intermediate layer.

The lens 271 as a molded article is manufactured by a mold having theabove mentioned structure. Here, the lens 271 is a convex lens. That is,the lens 271 has a structure where as being closer to a center part, thethickness is greater, and as being closer to an end part, the thicknessis less.

According to the mold insert body 11 of the related art shown in FIG. 1,as being close to a center part where the thickness of the resin as amolding material is greater, the cooling rate of the resin is lower. Asbeing close to an end part where the thickness of the resin as a moldingmaterial is thin, the cooling rate of the resin is higher. As a resultof this, as being close to the center part of the lens 271, thetemperature of the resin is higher. As being close to the end part ofthe lens 271, the temperature of the resin is lower so that thetemperature distribution of the resin and the coefficient of contractionare non-uniform.

In this embodiment, the thickness of the adiabatic layer 264 correspondsto a cooling way of resin in a cavity C of the mold, namely a coolingway of resin so as to have substantially equal temperature of respectiveparts of a molded article when the molded article is taken off from thecavity C of FIG. 6. The thickness of the adiabatic layer 264 isgradually increased from the center part to the end part.

Accordingly, as being closer to the center part, the cooling rate ishigher. As being closer to the end part, the cooling rate is lower.Therefore, the temperature distribution of the resin in the diameterdirection (from the center part to the end part) is constant, and thecoefficient of contraction is also constant in the diameter direction.

As a result of this, precision of the configuration (for example, acurved surface such as a spherical surface, and a non-spherical surface,and a plane surface, etc.) of the surface of the lens 271 can beimproved so that the quality of the lens 271 can be improved.

Next, a fourth embodiment of the present invention, which applies to amold for molding a lens made of plastic as a molded article, will bedescribed.

FIG. 13 is a view for explanation of a first deformation example of themold of the fourth embodiment of the present invention.

Referring to FIG. 13, a mold insert body 361 forming a part of the moldincludes a base layer 362, an outermost layer 363, and an adiabaticlayer 364. The base layer 362 is made of a first material. The outermostlayer 363 is made of a second material. The adiabatic layer 364 is madeof a third material having a low coefficient of thermal conductivity andfunctions as an intermediate layer. The gate part 372 is formed in thegate 82 shown in FIG. 6.

The lens 371 as a molded article is manufactured by a mold having theabove mentioned structure. Here, the lens 371 is a concave lens. Thatis, the lens 271 has a structure where as being closer to the centerpart, the thickness is less, and as being closer to an end part, thethickness is greater.

According to the mold insert body 11 of the related art shown in FIG. 1,since the coefficient of thermal conductivity is uniform, as beingcloser to the center part where the thickness of the resin as a moldingmaterial is less, the cooling rate of the resin is higher. As beingcloser to an end part where the thickness of the resin as a moldingmaterial is greater, the cooling rate of the resin is lower. As a resultof this, as being closer to the center part of the lens 371, thetemperature of the resin is lower. Hence, if the gate is formed at acircumference of the cavity C, as being closer to the center part it isdifficult for the resin to flow. As being closer to the circumferencepart it is easy for the resin to flow, and therefore a weld line isformed at an end part of flowing of the resin at a side opposite to thegate.

In this embodiment, the adiabatic layer 364 has a configuration wherethe thickness is gradually less as being from the center part to thecircumference part so as to correspond to the temperature distributionof the resin in the cavity C.

As being closer to the center part, the cooling rate of the resinbecomes lower and the temperature is higher. As being closer to thecircumference part, the cooling rate of the resin becomes higher and thetemperature is lower. Hence, the temperature distribution of the resinbecomes constant in a diameter direction (from the center part to thecircumference part). As a result of this, a weld line is prevented frombeing formed so that the quality of the lens 371 can be improved.

Thus, the mold of the present invention has the mold insert body made oftwo kinds of materials having different coefficients of thermalconductivity.

The union part is formed by sintering respective materials. Therefore,it is possible to reduce time for manufacturing the mold so thatreducing the cost for the mold can be obtained.

Furthermore, a configuration of the union part corresponds to a coolingway of the resin in the cavity space of the mold, namely a cooling wayof the resin so as to have substantially equal temperature of respectiveparts of the molded article when the molded article is taken off fromthe cavity. Accordingly, when the molded article is molded, thetemperature distribution of the molding material is uniform. As a resultof this, it is possible to manufacture the molded article stably withhigh precision so as to improve the quality of the molded article.

Furthermore, since plating treatment is not performed in the presentinvention, it is possible to manufacture the mold with high precision sothat a high yield rate can be achieved. Therefore, a connectioncharacteristic of two different materials can be improved. Furthermore,since the material of a layer is not restricted, it is possible tomanage a manufacturing condition of the mold easily.

The present invention is not limited to these embodiments, butvariations and modifications may be made without departing from thescope of the present invention.

For example, in the above respective embodiments, a material having alow coefficient of thermal conductivity is used for the intermediatelayer. However, a material having a high coefficient of thermalconductivity may be used and a configuration of a union part maycorrespond to a cooling way of resin in a cavity C of the mold, namely acooling way of resin so as to have substantially equal temperatures ofrespective parts of a molded article when the molded article is takenoff from the cavity C.

Furthermore, in the mold having a two layer structure wherein the baselayer and the outermost layer are formed, materials having differentcoefficients of thermal conductivity may be used for respective layers,and a configuration of a union part may correspond to a cooling way ofresin in a cavity of the mold, namely a cooling way of resin so as tohave substantially equal temperatures of respective parts of a moldedarticle when the molded article is taken off from the cavity space C.

Furthermore, in the above mentioned embodiment, the molded producthaving a relatively simple cross sectional configuration such as a diskor a lens is described. However, the present invention can be appliedfor manufacturing of an unsymmetrical configuration type molded article,a container having a deep bottom, and a thick walled molded article forwhich a relatively long period of cooling time is required at the timeof molding. That is, the above mentioned molded article may be molded byusing at least two kinds of materials having different coefficients ofthermal conductivity and by having corresponding configuration of aunion part to a cooling way of resin in a cavity of the mold, namely acooling way of resin so as to have substantially equal temperature ofrespective parts of a molded article when the molded article is takenoff from the cavity space C.

This patent application is based on Japanese priority patent applicationNo. 2002-160544 filed on May 31, 2002, the entire contents of which arehereby incorporated by reference.

1-10. (canceled)
 11. A method for manufacturing a mold, comprising thesteps of: a) providing a powder of a first material; b) providing apowder of a second material different from the powder of the firstmaterial so as to form a configuration that corresponds to a cooling wayof a molding material flowed in a cavity forming part of the mold; andc) sintering the respective powders by putting the powders of therespective materials between a first electrode and a second electrode,by pressuring with a designated pressure power, and by sending adesignated electric current to the powders of the respective materials.12. The method for manufacturing the mold as claimed in claim 11,further comprising the step of: d) providing a powder of a thirdmaterial having a coefficient of thermal conductivity different from thefirst material and second material.
 13. The method for manufacturing themold as claimed in claim 11, wherein the powders of the respectivematerials are sintered in a body.
 14. The method for manufacturing themold as claimed in claim 11, wherein powders of the respective materialsare sintered by discharge plasma.
 15. The method for manufacturing themold as claimed in claim 1 1, further comprising; forming a mold patternis formed on the first electrode and the second electrode, and whereinthe mold pattern corresponds to a configuration of a molded articlemanufactured by the mold.
 16. The method for manufacturing the mold asclaimed in claim 11, further comprising the step of: e) forming aninclination layer in between respective layers by filling a mix powdermade of the powders of the respective materials.
 17. The method formanufacturing the mold as claimed in claim 16, wherein a ratio of thefirst material to the second material varies along a cross section ofthe mold insert body.
 18. The method for manufacturing the mold asclaimed in claim 1 1, wherein the cooling way of the molding material isdetermined by a cooling rate of the molding material or a difference ofa temperature of the molding material at respective parts in the cavityforming part.